micro drilling ,cutting, engraving and etching metal,ceramics,silicon,glass,organics and so on
Application
flexible circuit board cutting, ITO film etching, micro electronic device manufacturing, printing template preparation, biological chip preparation, precision mold forming.
1. The high power and high stability ultraviolet laser directly ablates material, μm heat affected zone;
2. The imported precision galvanometer with high speed and high precision controls beam offset, realizing small format machining with high speed and high precision ;
3. μm precision high speed linear motor platform translates the workpiece to achieve a large format micro machining;
4. Z axis, electric adjustable to accommodate different thickness of material, meets the requirements of three-dimensional structure etching;
5. Paraxial super-resolution industrial camera for galvanometer full format error correction and ultra high precision focus, to ensure long-term use stability and accuracy;
6. The effect of laser processing is on-line detected, rapidly optimiz processing technology;
7. The marble table enhances the overall stability of the system, all mechanical components are carefully selected to ensure the long-term accuracy.
|
Component |
Parameter |
FM-Mirco10-355A |
FM-Micro10-355B |
|
Laser |
Wavelength |
355nm |
355nm |
|
Power |
＞10W@30kHz |
10W@40kHz |
|
|
Moldulated frequency |
0~300kHz |
20~200kHz |
|
|
Pulse width |
15ns@20kHz |
20ns@40kHz |
|
|
Beam quality M2 |
＜1.2 |
≤1.2 |
|
|
Power stablity（8h） |
＜3% |
＜3% |
|
|
Beam pointing stablity |
＜20μrad/℃ |
＜25μrad/℃ |
|
|
Beam roundness |
＞90% |
≥90% |
|
|
Scanner |
Scan scale |
＜50*50mm |
＜50*50mm |
|
Reposition accuracy |
＜1μm |
＜1μm |
|
|
Position accuracy |
≤±3μm |
≤±3μm |
|
|
Scan speed |
≤3.5m/s |
≤3.5m/s |
|
|
Position speed |
≤12m/s |
≤12m/s |
|
|
XY worktable |
Scale |
200*300mm |
200*300mm |
|
Resolution |
0.1μm |
0.1μm |
|
|
Reposition accuracy |
≤±1μm |
≤±1μm |
|
|
Position accuracy |
≤±3μm |
≤±3μm |
|
|
Acceleration |
≤1G |
≤1G |
|
|
Speed |
≤800mm/s |
≤800mm/s |
|
|
Z axis |
Scale |
50mm |
50mm |
|
Reposition accuracy |
≤±3μm |
≤±3μm |
|
|
Position accuracy |
≤±5μm |
≤±5μm |
|
|
CCD |
Magnification |
40X |
40X |
|
Resolution |
0.1μm |
0.1μm |
|
|
Region splicing |
Accuracy |
±3μm |
±3μm |
|
Processing |
Minimum width |
10μm |
10μm |
|
Accuracy |
±10μm |
±10μm |
|
|
Reposition accuracy |
≤±3μm |
≤±3μm |
|
|
Maximum depth width ratio |
＞20:1 |
＞20:1 |
|
|
Material |
metal,ceramics,silicon,glass,organics |
metal,ceramics,silicon,glass,organics |
|
|
Speed |
High |
High |
|
|
Cooling |
Water cooling |
||
|
Dust purification |
Three layer dust purification |
||
|
Power supply |
220V 50~60Hz 12A |
||
|
Power consumer |
≤2500W |
||
Note: Parameters detected after 30 minutes at constant temperature（25±0.5℃）
|
micro hole drilling in polysilicon
|
|
200μm thickness,~50μm hole size,500 holes/s by 18.6W@100kHz. |
|
silicon precise etching  |
|
100μm thickness,375mm/s by 20W@100kHz |
|
glass precise cutting  |
|
1mm thickness,2mm hole size，6 s/hole by 20W@100kHz. |
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